Datasheet

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UNITY-GAIN STABLE OP AMP
DECOMPENSATED OP AMP
LMP7707, LMP7708, LMP7709
SNOSAW5B –JUNE 2007–REVISED MARCH 2013 www.ti.com
Open Loop Frequency Response
Figure 1. Increased Bandwidth for Same Supply Current at A
V
> 10
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Human Body Model 2000V
ESD Tolerance
(3)
Machine Model 200V
Charge Device Model 1000V
V
IN
Differential ±300 mV
Supply Voltage (V
S
= V
+
– V
−
) 13.2V
Voltage at Input/Output Pins V
+
+ 0.3V to V
−
− 0.3V
Input Current 10 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Infrared or Convection (20 sec) 235°C
Soldering Information
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to +125°C
Supply Voltage (V
S
= V
+
– V
−
) 2.7V to 12V
5-Pin SOT-23 265°C/W
8-Pin SOIC 190°C/W
Package Thermal Resistance (θ
JA
)
(2)
8-Pin VSSOP 235°C/W
14-Pin TSSOP 122°C/W
14-Pin SOIC 145°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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