Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMP7701MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP7701MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LMP7701MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMP7701MFX SOT-23 DBV 5 3000 210.0 185.0 35.0
LMP7701MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMP7702MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP7702MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMP7702MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP7702MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMP7704MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMP7704MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2