Datasheet

+
R
S
Z
LOAD
V
1
V
2
R
R
R
R
V
+
V
+
V
-
V
-
+
-
-
I = (V
2
± V
1
)
R
S
A
1
A
2
LMP7701, LMP7702, LMP7704
SNOSAI9H –SEPTEMBER 2005–REVISED MARCH 2013 www.ti.com
TYPICAL APPLICATION
Figure 1. Precision Current Source
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge-Device Model 1000V
V
IN
Differential ±300 mV
Supply Voltage (V
S
= V
+
– V
−
) 13.2V
Voltage at Input/Output Pins V
+
+ 0.3V, V
−
− 0.3V
Input Current 10 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LMP7701 LMP7702 LMP7704