Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMP2232AMAE/NOPB SOIC D 8 250 210.0 185.0 35.0
LMP2232AMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP2232AMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP2232AMME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP2232AMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMP2232BMAE/NOPB SOIC D 8 250 210.0 185.0 35.0
LMP2232BMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP2232BMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP2232BMME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP2232BMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2