Datasheet
-
+
1/2
LMP2022
0.1 PF
-
+
1/2
LMP2022
0.1 PF
5.1 k:
0.1%
5.1 k:
0.1%
200:
200:
280:
V
A
V
A
+
-
V
A
LMP2021
ADC161S626
+
V
R
= 1/2 V
A
-
1 k:
1 k:
R
3
R
4
R
1
R
2
V
A
EMI
180:
470 pF
V
A
= 5V
LMP2021, LMP2022
SNOSAY9E –SEPTEMBER 2008–REVISED MARGH 2013
www.ti.com
TYPICAL APPLICATION
Figure 1. Bridge Amplifier
The LMP2021/LMP2022 support systems with up to 24 bits of accuracy.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge Device Model 1000V
V
IN
Differential ±V
S
Supply Voltage (V
S
= V
+
– V
−
) 6.0V
All Other Pins V
+
+ 0.3V, V
−
− 0.3V
Output Short-Circuit Duration to V
+
or V
−(4)
5s
Storage Temperature Range −65°C to 150°C
Junction Temperature
(5)
150°C max
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temperature (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per
JESD22-C101-C.
(4) Package power dissipation should be observed.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θJ
A
. All numbers apply for packages soldered directly onto a PC board.
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