Datasheet

L M K 0 4 8 1 6 E V A L U A T I O N B O A R D O P E R A T I N G I N S T R U C T I O N S
SNLU107
56
Appendix E: PCB Layers Stackup
6-layer PCB Stackup includes:
Top Layer for high-priority high-frequency signals (2 oz.)
RO4003 Dielectric, 16 mils
RF Ground plane (1 oz.)
FR4, 4 mils
Power plane #1 (1 oz.)
FR4, 12.6 mils
Ground plane (1 oz.)
FR4, 8 mils
Power Plane #2 (1 oz.)
FR4, 12 mils
Bottom Layer copper clad for thermal relief (2 oz.)
RO4003 (Er = 3.3)
16 mil
Top Layer [LMK04816ENG.GTL]
RF Ground plane [LMK04816ENG.GP1]
FR4 (Er = 4.8)
4 mil
Power plane #1 [LMK04816ENG.G1]
FR4
12.6 mil
Ground plane [LMK04816ENG.GP2]
FR4
12 mil
Bottom Layer [LMK04816ENG.GBL]
62.2 mil thick
FR4
8 mil
Power plane #2 [LMK04816ENG.G2]