Datasheet

L M K 0 4 1 X X - R E V 3 E V A L U A T I O N B O A R D O P E R A T I N G I N S T R U C T I O N S
SNLU099
25
Appendix D: Board Layers Stackup
Layers of the 6 layer evaluation board include:
Blue is dielectrics
Top layer for high priority high frequency signals
o 1 oz CU
RO4003 Dielectric, 16 mils
Ground plane
FR4, 2.5 mils thick.
Power plane #1 – VccCLK
FR4, xx mils
middle ground plane
FR4, xx mils
VccPLL, VccAux
FR4, xx mils
Bottom layer copper clad for thermal relief
Top to bottom layer order:
LMK04100.GTL (1) top copper
LMK04100.GP1 (2) gnd
LMK04100.GP2 (3) vcc
LMK04100.GP3 (4) gnd
LMK04100.G1 (5) vcc
LMK04100.GBL (6) bottom copper
RO4003 (Er = 3.38)
CONTROLLED THICKNESS of
16 mils thick
Top Copper. 1oz thick [LMK04100.GTL]
GND plane [LMK04100.GP1]
FR4 (Er = ~4.6)
CONTROLLED THICKNESS: 2.5 mils
thick
VccCLK plane [LMK04100.GP2]
FR4
Middle Ground Plane
FR4
Bottom Copper – Thermal relief
[LMK04100.GBL]
62 mils thick total
FR4
Vcc mixed plane [LMK04100.G1]