Datasheet

28 SNAU045A LMK040xx Evaluation Board User’s Guide November 2013
Copyright © 2013, Texas Instruments Incorporated
www.ti.com
Appendix B: Board Layers Stackup
Layers of the 6 layer evaluation board include:
Blue is dielectrics
 Top layer for high priority high frequency signals
o 1 oz CU
 RO4003 Dielectric, 16 mils
 Ground plane
 FR4, 2.5 mils thick.
 Power plane #1 – VccCLK
 FR4, xx mils
 middle ground plane
 FR4, xx mils
 VccPLL, VccAux
 FR4, xx mils
 Bottom layer copper clad for thermal relief
Top to bottom layer order:
LMK04000.GTL (1)
LMK04000.GP1 (2) gnd
LMK04000.GP2 (3) vcc
LMK04000.GP3 (4) gnd
LMK04000.G1 (5) vcc
LMK04000.GBL (6)
RO4003 (Er = 3.38)
CONTROLLED THICKNESS of
16 mils thick
Top Copper. 1oz thick [LMK04000.GTL]
GND plane [LMK04000.GP1]
FR4 (Er = ~4.6)
CONTROLLED THICKNESS: 2.5 mils
thick
VccCLK plane [LMK04000.GP2]
FR4
?? mils thick
Middle Ground Plane
FR4
?? mils thick
Bottom Copper – Thermal relief
[Bulova.GBL]
62 mils thick total
FR4
?? mils thick
Vcc mixed plane [LMK04000.G1]