Datasheet

November 2013 LMK3806 Evaluation Board SNAU075A 35
Copyright © 2013, Texas Instruments Incorporated
15. PCB Layers Stackup
6-layer PCB Stackup includes:
 Top Layer for high-priority high-frequency signals (2 oz.)
 FR4 Dielectric, 19 mils
 RF Ground plane (1 oz.)
 FR4, 14.5 mils
 Power plane (1 oz.)
 FR4, 19 mils
 Bottom Layer copper clad for thermal relief (2 oz.)
FR4 (Er = 4.8)
19 mil
Top Layer [LMK03806ENG.GTL]
RF Ground plane [LMK03806ENG.G1]
FR4 (Er = 4.8)
14.5 mil
Power plane #1 [LMK03806ENG.G2]
FR4
19 mil
Bottom Layer [LMK03806ENG.GBL]
61.3 mil thick
Figure 21: PCB Stackup