Datasheet
LMK03000, LMK03000C, LMK03000D, LMK03001
LMK03001C, LMK03001D, LMK03033, LMK03033C
SNAS381O –NOVEMBER 2006–REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
3 Electrical Specifications
3.1 Absolute Maximum Ratings
(1)(2)(3)
Parameter Symbol Ratings Units
Power Supply Voltage V
CC
-0.3 to 3.6 V
Input Voltage V
IN
-0.3 to (V
CC
+ 0.3) V
Storage Temperature Range T
STG
-65 to 150 °C
Lead Temperature (solder 4 s) T
L
+260 °C
Junction Temperature T
J
125 °C
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD
protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
3.2 Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Ambient Temperature T
A
-40 25 85 °C
Power Supply Voltage V
CC
3.15 3.3 3.45 V
3.3 Package Thermal Resistance
Package θ
JA
θ
J-PAD (Thermal Pad)
48-Lead WQFN
(1)
27.4° C/W 5.8° C/W
(1) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These
vias play a key role in improving the thermal performance of the WQFN. It is recommended that the maximum number of vias be used in
the board layout.
6 Electrical Specifications Copyright © 2006–2013, Texas Instruments Incorporated
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LMK03033C