Datasheet
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2
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9
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12
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14
15
16
24
23
22
21
20
19
18
17
CLKout0
CLKout1
CLKout2
CLKout3
CLKout4
Vddo
GND
Vddo
Vddo
GND
Vddo
GND
Vdd
CLKin
GND
OE
SEL
CLKin*
GND
OSCin
GND
GND
Vdd
OSCout
DAP
LMK00105
SNAS579F –MARCH 2012–REVISED MAY 2013
www.ti.com
Connection Diagram
24-Pin WQFN Package
PIN DESCRIPTIONS
Pin # Pin Name Type Description
DAP DAP - The DAP should be grounded
2, 6 Vddo Power Power Supply for Bank A (CLKout0 and CLKout 1) CLKout pins.
3 CLKout0 Output LVCMOS Output
1,4,7,11,
GND GND Ground
12, 16,19
5 CLKout1 Output LVCMOS Output
8,23 Vdd Power Supply for operating core and input buffer
9 OSCin Input Input for Crystal
10 OSCout Output Output for Crystal
13 CLKout2 Output LVCMOS Output
14,18 Vddo Power Power Supply for Bank B (CLKout2 to CLKout 4) CLKout pins
15 CLKout3 Output LVCMOS Output
17 CLKout4 Output LVCMOS Output
20 CLKin* Input Complementary input pin
21 CLKin Input Input Pin
22 SEL Input Input Clock Selection. This pin has an internal pull-down resistor.
(1)
24 OE Input Output Enable. This pin has an internal pull-down resistor.
(1)
(1) CMOS control input with internal pull-down resistor.
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