Datasheet

LMH7322
SNOSAU8I –MARCH 2007–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2.5 kV
Machine Model 250V
Output Short Circuit Duration See
(4)(5)(6)
Supply Voltages (V
CCx
–V
EE
) 13.2V
Differential Voltage at Input Pins ±13V
Voltage at Input Pins V
EE
-0.2V to V
CCI
+ 0.2V
Voltage at LE Pins V
EE
-0.2V to V
CCO
+0.2V
Current at Output Pins 25mA
Soldering Information:
See Product Folder at www.ti.com and SNOA549
Storage Temperature Range −65°C to +150°C
Junction Temperature
(7)
+150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) Short circuit test is a momentary test. See next note.
(6) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
(7) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Operating Conditions
(1)
Supply Voltage (V
CCx
–V
EE
) 2.7V to 12V
Operating Temperature Range
(2)(3)
−40°C to +125°C
Package Thermal Resistance
(2)(3)
24-Pin WQFN 38°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
(3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
. See Applications section for information on temperature de-rating of this device.
2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH7322