Datasheet

LMH6881
SNOSC72E –JUNE 2012–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 1 kV
Charged Device Model 250V
Positive Supply Voltage (VCC) −0.6V to 5.5V
Differential Voltage between Any Two Grounds <200 mV
Analog Input Voltage Range −0.6V to 5.5V
Digital Input Voltage Range −0.6V to 5.5V
Output Short Circuit Duration (one pin to ground) Infinite
Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Soldering Information Infrared or Convection (30 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For verified specifications, see the Electrical
Characteristics table.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Field-Induced Charge-Device Model, applicable std. JESD22-C101-
C (ESD FICDM std. of JEDEC).
Operating Ratings
(1)
Supply Voltage (VCC) 4.75V to 5.25V
Differential Voltage Between Any Two Grounds <10 mV
Analog Input Voltage Range, AC Coupled 0V to VCC
Temperature Range
(2)
−40°C to +85°C
Package Thermal Resistance
(3)
24–pin WQFN (θ
JA
) 53°C/W
(θ
JC
) 6°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For verified specifications, see the Electrical
Characteristics table.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and the ambient temperature T
A
. The maximum allowable power dissipation
at any ambient temperature is P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
(3) Junction to ambient (θ
JA
) thermal resistance measured on JEDEC 4-layer board. Junction-to-case (θ
JC
) thermal resistance measured at
exposed thermal pad; package is not mounted to any PCB.
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