Datasheet

LMH6733
SNOSAW0D –JANUARY 2007–REVISED MAY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Supply Voltage (V
+
- V
–
) 13.2V
I
OUT
(4)
Common Mode Input Voltage ±V
CC
Maximum Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Soldering Information
Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
Storage Temperature Range −65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum output current (I
OUT
) is determined by device power dissipation limitations. See the Power Dissipation section of the
Applications Information for more details.
Operating Ratings
(1)
Thermal Resistance
Package (θ
JC
) (θ
JA
)
16-Pin SSOP 36°C/W 120°C/W
Temperature Range
(2)
−40°C +85°C
Supply Voltage (V
+
- V
–
) 3V to 12V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
5V Electrical Characteristics
(1)
A
V
= +2, V
CC
= 5V, R
L
= 100Ω, R
F
= 340Ω; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
Frequency Domain Performance
UGBW −3 dB Bandwidth Unity Gain, V
OUT
= 200 mV
PP
870 MHz
SSBW −3 dB Bandwidth V
OUT
= 200 mV
PP
, R
L
= 100Ω 650
SSBW V
OUT
= 200 mV
PP
, R
L
= 150Ω 685 MHz
LSBW V
OUT
= 2 V
PP
480
0.1 dB 0.1 dB Gain Flatness V
OUT
= 200 mV
PP
320 MHz
BW
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
.
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