Datasheet

LMH6723, LMH6724, LMH6725
SNOSA83H –AUGUST 2003–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
V
CC
(V
+
- V
-
) ±6.75V
I
OUT
120 mA
(3)
Common Mode Input Voltage ±V
CC
Maximum Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
ESD Tolerance
(4)
Human Body Model 2000V
Machine Model 200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum continuous output current (I
OUT
) is determined by device power dissipation limitations. See the POWER DISSIPATION
section for more details.
(4) Human Body Model, 1.5 kΩ in series with 100 pF. Machine Model, 0Ω In series with 200 pF.
Operating Ratings
(1)
Thermal Resistance
Package (θ
JA
)
8-Pin SOIC 166°C/W
5-Pin SOT-23 230°C/W
14-Pin SOIC 130°C/W
14-Pin TSSOP 160°C/W
Operating Temperature Range −40°C to +85°C
Nominal Supply Voltage 4.5V to 12V
(1) The maximum continuous output current (I
OUT
) is determined by device power dissipation limitations. See the POWER DISSIPATION
section for more details.
2 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: LMH6723 LMH6724 LMH6725