Datasheet

LMH6704
SNOSAD0C –FEBRUARY 2005–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance
(2)
Human Body Model 2000V
Machine Model 200V
Supply Voltage 13.5V
I
OUT
(3)
Common-Mode Input Voltage V
S
−
to V
S
+
Maximum Junction Temperature 150°C
Storage Temperature Range −65°C to 150°C
Infrared or Convection (20 sec.) 235°C
Soldering Information Wave Soldering (10 sec.) 260°C
Lead Temp. (soldering 10 sec.) 300°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum output current (I
OUT
) is determined by device power dissipation limitations.
Operating Ratings
(1)
Nominal Supply Voltage ±4V to ±6V
Temperature Range
(2)
−40°C to 85°C
Thermal Resistance
Package (θ
JC
) (θ
JA
)
8-Pin SOIC 75°C/W 160°C/W
6-Pin SOT23 120°C/W 187°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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