Datasheet

LMH6672
SNOS957G –APRIL 2001–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance
(2)
Human Body Model 2kV
Machine Model 200V
V
IN
Differential ±1.2V
Output Short Circuit Duration See
(3)
Supply Voltage (V
+
− V
−
) 13.2V
Voltage at Input/Output pins V
+
+0.8V, V
−
−0.8V
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
(4)
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Human body model, 1.5kΩ in series with 100pF. Machine model, 200Ω in series with 100pF.
(3) Shorting the output to either supply or ground will exceed the absolute maximum T
J
and can result in failure.
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage (V
+
- V
−
) ±2.5V to ±6.5V
Junction Temperature Range −40°C to 150°C
Package Thermal Resistance (θ
JA
)
8-pin SOIC 172°C/W
8-pin SO PowerPAD (DDA) 58.6°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
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