Datasheet
Table Of Contents
PACKAGE OPTION ADDENDUM
www.ti.com
9-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH6642MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMH66
42MA
LMH6642MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMH66
42MA
LMH6642MF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A64A
LMH6642MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A64A
LMH6642MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A64A
LMH6643MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMH66
43MA
LMH6643MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMH66
43MA
LMH6643MAX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMH66
43MA
LMH6643MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMH66
43MA
LMH6643MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 A65A
LMH6643MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A65A
LMH6643MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A65A
LMH6644MA/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMH6644MA
LMH6644MAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMH6644MA
LMH6644MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMH66
44MT
LMH6644MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMH66
44MT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.