Datasheet

LMH6639
SNOS989G –JANUARY 2002–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance 2KV
(3)
200V
(4)
V
IN
Differential ±2.5V
Input Current ±10mA
Supply Voltage (V
+
– V
−
) 13.5V
Voltage at Input/Output pins V
+
+0.8V, V
−
−0.8V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(5)(6)
+150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Machine Model, 0Ω in series with 200pF.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
Operating Ratings
(1)
Supply Voltage (V
+
to V
−
) 3V to 12V
Operating Temperature Range
(2)
−40°C to +85°C
Package Thermal Resistance (θ
JA
)
(2)
SOT-23-6 265°C/W
SOIC-8 190°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
3V Electrical Characteristics
Unless otherwise specified, all limits ensured for at T
J
= 25°C, V
+
= 3V, V
−
= 0V, V
O
= V
CM
= V
+
/2, and R
L
= 2kΩ to V
+
/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min
(1)
Typ
(2)
Max
(1)
Units
BW −3dB BW A
V
= +1 120 170
MHz
A
V
= −1 63
BW
0.1dB
0.1dB Gain Flatness R
F
= 2.65kΩ , R
L
= 1kΩ, 16.4 MHz
FPBW Full Power Bandwidth A
V
= +1, V
OUT
= 2V
PP
, −1dB 21 MHz
V
+
= 1.8V, V
−
= 1.2V
GBW Gain Bandwidth product A
V
= +1 83 MHz
e
n
Input-Referred Voltage Noise R
F
= 33kΩ f = 10kHz 19
nV/√Hz
f = 1MHz 16
i
n
Input-Referred Current Noise R
F
= 1MΩ f = 10kHz 1.30
pA/√Hz
f = 1MHz 0.36
THD Total Harmonic Distortion f = 5MHz, V
O
= 2V
PP
, A
V
= +2, −50
dBc
R
L
= 1kΩ to V
+
/2
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
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