Datasheet

LMH6624
SNOSA42F –NOVEMBER 2002–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance
Human Body Model 2000V
(2)
Machine Model 200V
(3)
V
IN
Differential ±1.2V
Supply Voltage (V
+
- V
−
) 13.2V
Voltage at Input pins V
+
+0.5V, V
−
−0.5V
Soldering Information
Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
,
(5)
+150°C
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Human body model, 1.5kΩ in series with 100pF.
(3) Machine Model, 0Ω in series with 200pF.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Operating Temperature Range
(2)
,
(3)
−40°C to +125°C
Package Thermal Resistance (θ
JA
)
(3)
SOIC-8 166°C/W
SOT23–5 265°C/W
VSSOP-8 235°C/W
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(3) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMH6624