Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH6624MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6624MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6624MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6624MFX SOT-23 DBV 5 3000 210.0 185.0 35.0
LMH6624MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMH6626MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6626MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMH6626MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2