Datasheet

LMH6622
SNOS986D –DECEMBER 2001–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
Human Body Model 2kV
(3)
Machine Model 200V
(3)
V
IN
Differential ±1.2V
Supply Voltage (V
+
– V
−
) 13.2V
Voltage at Input Pins V
+
+0.5V, V
−
−0.5V
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 200pF.
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage (V
+
– V
−
) ±2.25V to ±6V
Junction Temperature Range
(2)
,
(3)
−40°C to +85°C
Package Thermal Resistance
(3)
(θ
JA
)
8-pin SOIC 166°C/W
8-pin VSSOP 211°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(3) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
±6V Electrical Characteristics
Unless otherwise specified, T
J
= 25°C, V
+
= 6V, V
−
= −6V, V
CM
= 0V, A
V
= +2, R
F
= 500Ω, R
L
= 100Ω. Boldface limits apply
at the temperature extremes.
Symbol Parameter Conditions Min Typ Max Units
(1) (2) (1)
Dynamic Performance
f
CL
−3dB BW V
O
= 200mV
PP
160 MHz
BW
0.1dB
0.1dB Gain Flatness V
O
= 200mV
PP
30 MHz
SR Slew Rate
(3)
V
O
= 2V
PP
85 V/μs
TS Settling Time V
O
= 2V
PP
to ±0.1% 40
ns
V
O
= 2V
PP
to ±1.0% 35
Tr Rise Time V
O
= 0.2V Step, 10% to 90% 2.3 ns
Tf Fall Time V
O
= 0.2V Step, 10% to 90% 2.3 ns
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) Slew rate is the slowest of the rising and falling slew rates.
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