Datasheet
LMH6618
ADC121S101
0.1 PF
C
6
10 PF
C
5
0.1 PF
C
13
10 PF
C
11
0.1 PF
V
+
0.01 PF
14.3 k:
0.1 PF
1 PF
GND
5V
1.24 k:
1 nF
150 pF
549:
V
+
-
+
22:
390 pF
549:
IN
1 PF
V
+
14.3 k:
5.6 PF
LMH6618, LMH6619
SNOSAV7E –AUGUST 2007–REVISED OCTOBER 2012
www.ti.com
Typical Application
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
ESD Tolerance
(2)
Human Body Model
For input pins only 2000V
For all other pins 2000V
Machine Model 200V
Supply Voltage (V
S
= V
+
– V
−
) 12V
Junction Temperature
(3)
150°C max
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX
) – T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
OPERATING RATINGS
(1)
Supply Voltage (V
S
= V
+
– V
−
) 2.7V to 11V
Ambient Temperature Range
(2)
−40°C to +125°C
Package Thermal Resistance (θ
JA
)
6-Pin SOT (DDC0006A) 231°C/W
8-Pin SOIC (D0008A) 160°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX
) – T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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