Datasheet

LMH6559
SNOSA57C –APRIL 2003–REVISED MARCH 2013 www.ti.com
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Output Short Circuit Duration See
(4)
,
(5)
and
(6)
Supply Voltage (V
+
– V
−
) 13V
Voltage at Input/Output Pins V
+
+0.8V, V
−
−0.8V
Soldering Information Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) Short circuit test is a momentary test.
(6) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
– T
A
) / θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage (V
+
- V
−
) 3 - 10V
Temperature Range
(2)(3)
−40°C to +85°C
Package Thermal Resistance
(2)(3)
8-Pin SOIC 172°C/W
5-Pin SOT-23 235°C/W
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
– T
A
) / θ
JA
. All numbers apply for packages soldered directly onto a PC board.
(3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. There is no specification of parametric performance as indicated in the electrical
tables under conditions of internal self-heating where T
J
> T
A
. See Applications section for information on temperature de-rating of this
device.
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