Datasheet

LMH6552
SNOSAX9H –APRIL 2007–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance
(2)
Human Body Model 2000V
Machine Model 200V
Supply Voltage 13.2V
Common Mode Input Voltage ±V
S
Maximum Input Current (pins 1, 2, 7, 8) 30 mA
Maximum Output Current (pins 4, 5)
(3)
Maximum Junction Temperature 150°C
Soldering Information
For soldering specifications see SNOA549C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) Human Body Model, applicable std. MIL-STD-883, Method 30157. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum output current (I
OUT
) is determined by device power dissipation limitations. See POWER DISSIPATION of Application
Information for more details.
Operating Ratings
(1)
Operating Temperature Range
(2)
−40°C to +85°C
Storage Temperature Range −65°C to +150°C
Total Supply Voltage 4.5V to 12V
Package Thermal Resistance (θ
JA
)
8-Pin SOIC 150°C/W
8-Pin WSON 58°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
) / θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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