Datasheet
-
4
+OUT
5
-OUT
3
6
V+
V-
NC
2
7
V
CM
+
1
8
-IN
+IN
LMH6551
SNOSAK7C –FEBRUARY 2005–REVISED MARCH 2013
www.ti.com
Connection Diagram
Figure 2. 8-Pin SOIC & VSSOP - Top View
See Package Number D0008A and DGK0008A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Supply Voltage 13.2V
Common Mode Input Voltage ±Vs
Maximum Input Current (pins 1, 2, 7, 8) 30mA
Maximum Output Current (pins 4, 5)
(4)
Maximum Junction Temperature 150°C
Soldering Information
See Product Folder at www.ti.com and SNOA549
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model: 1.5 kΩ in series with 100 pF. Machine model: 0Ω in series with 200pF.
(4) The maximum output current (I
OUT
) is determined by device power dissipation limitations.
Operating Ratings
(1)
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Total Supply Voltage 3V to 12V
Package Thermal Resistance (θ
JA
)
(2)
8-Pin VSSOP 235°C/W
8-Pin SOIC 150°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
— T
A
)/ θ
JA
. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LMH6551