Datasheet

LMH6518
SNOSB21C –MAY 2008–REVISED JULY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge Device Model 1000V
Supply Voltage
V
CC
(5V nominal) 5.5V
V
DD
(3.3V nominal) 3.6V
Differential Input ±1V
Input Common Mode Voltage 1V to 4V
V
CM
and V
CM_Aux
2V
SPI Inputs 3.6V
Maximum Junction Temperature 150°C
Storage Temperature Range −65°C to 150°C
Soldering Information
Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Operating Ratings
(1)
Supply Voltage V
CC
= 5V (±5%)
V
DD
= 3.3V (±5%)
Temperature Range −40°C to 85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
Thermal Properties
Temperature Range
(1)
−40°C to 85°C
Junction-to-Ambient
Thermal Resistance (θJ
A
), WQFN
(1)
40°C/W
(1) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
Package should be soldered unto a 6.8 mm
2
copper area as shown in the “recommended land pattern” shown in the package drawing.
Electrical Characteristics
(1)
Unless otherwise specified, all limits are ensured for T
A
= 25°C, Input CM = 2.5V, V
CM
= 1.2V, V
CM_Aux
= 1.2V, Single-ended
input drive, V
CC
= 5V, V
DD
= 3.3V, R
L
= 100Ω differential (both Main & Auxiliary Outputs), V
OUT
= 0.7 V
PP
differential (both
Main & Auxiliary Outputs), both Main and Auxiliary Output Specifications, full bandwidth setting, gain = 18.8 dB (Preamp LG,
0 dB ladder attenuation), Full Power setting
(2)
. Electrical Characteristics Definition of Terms and Specifications for
abbreviations used in the datasheet. Boldface limits apply at the temperature extremes.
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
.
(2) “Full Power” setting is with Auxiliary output turned on.
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