Datasheet
LMH6505
SNOSAT4E –DECEMBER 2005–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Input Current ±10 mA
Output Current
(4)
120 mA
Supply Voltages (V
+
- V
−
) 12.6V
Voltage at Input/ Output pins V
+
+0.8V, V
−
−0.8V
Storage Temperature Range −65°C to 150°C
Junction Temperature 150°C
Soldering Information:
Infrared or Convection (20 sec) 235°C
Wave Soldering (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum output current (I
OUT
) is determined by device power dissipation limitations or value specified, whichever is lower.
Operating Ratings
(1)
Supply Voltages (V
+
- V
−
) 7V to 12V
Temperature Range
(2)
−40°C to +85°C
Thermal Resistance: (θ
JC
) (θ
JA
)
8 -Pin SOIC 60 165
8-Pin VSSOP 65 235
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX
) – T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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