Datasheet
LMH1980
www.ti.com
SNLS263A –JULY 2007–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 3.5 kV
Machine Model 350V
Supply Voltage, V
CC
0V to 5.5V
Video Input, V
IN
−0.3V to V
CC
+ 0.3V
Storage Temperature Range −65°C to +150°C
Lead Temperature (soldering 10 sec.) 300°C
Junction Temperature, T
JMAX
(4)
+150°C
Thermal Resistance, θ
JA
(no airflow) 120°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) All voltages are measured with respect to GND, unless otherwise specified.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to +85°C
V
CC
3.3V −10% to 5V +10%
Input Amplitude, V
IN-AMPL
140 mV to V
CC
–V
IN-CLAMP
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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