Datasheet
LMH1251
www.ti.com
SNLS193J –AUGUST 2005–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
ESD Tolerance Susceptibility
(4)
4.0 kV
Machine Model
(5)
400V
Supply Voltage V
CC
, Pins 7 and 17 5.5V
Voltage at any Input Pin (V
IN
) V
CC
−0.5 ≥ V
IN
≥ 0V
Video Inputs (pk-pk) 0.0V ≤ V
IN
≤ 1.2V
Thermal Resistance to Ambient (θ
JA
) 110°C/W
Thermal Resistance to Case (θ
JC
) 25°C/W
Junction Temperature (T
J
) +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (soldering 10 sec.) 265°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) All voltages are measured with respect to GND, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(5) The Machine Model ESD test is covered by specification EIAJ IC-121-1981. A 200 pF cap is charged to the specific voltage, then
discharged directly into the IC with no external series resistor (resistance of discharge path must be under 50Ω).
Operating Ratings
(1)
Operating Temperature Range
(2)
−20°C to +80°C
Supply Voltage (V
CC
) 4.75V ≤ V
CC
≤ 5.25V
RGB Video Inputs (pk-pk) 0.0V ≤ V
IN
≤ 0.7V
Y Video Inputs (incl. Sync) -0.3V ≤ V
IN
≤ 0.7V
P
B
P
R
Video Inputs -0.35V ≤ V
IN
≤ 0.35V
(1) Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. All video inputs
must be properly terminated.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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