Datasheet
1
4
3
2
LMH0384
(top view)
12
9
10
11
85 6 7
1316 15 14
V
EE
SPI_EN
SDI
SDI SDO
SDO
MISO
SS
AEC+
AEC-
MUTE
REF
MOSI
V
CC
V
CC
SCK
CD
DAP = V
EE
1
4
3
2
LMH0384
(top view)
12
9
10
11
85 6 7
1316 15 14
V
EE
SPI_EN
SDI
SDI SDO
SDO
AUTO SLEEP
V
EE
AEC+
AEC-
BYPASS
MUTE
REF
CD
V
CC
V
CC
MUTE
DAP = V
EE
LMH0384
SNLS308F –APRIL 2009–REVISED APRIL 2013
www.ti.com
CONNECTION DIAGRAM
Pin Mode (non-SPI) / SPI_EN = GND / LMH0344 Compatible
NOTE: The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
SPI Mode / SPI_EN = V
CC
NOTE: The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Figure 4. 16-Pin WQFN
Package Number RUM
PIN DESCRIPTIONS – Pin Mode (non-SPI) / SPI_EN = GND / LMH0344 Compatible
Pin Name I/O, Type Description
1 V
EE
Ground Negative power supply (ground).
2 SDI I, SDI Serial data true input.
3 SDI I, SDI Serial data complement input.
4 SPI_EN I, LVCMOS SPI register access enable. This pin has an internal pulldown.
H = SPI register access mode.
L = Pin mode.
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