Datasheet

1
4
3
2
LMH0302
(top view)
12
9
10
11
85 6 7
1316 15 14
V
EE
SDI
SDI
SDO
SD/HD
V
CC
NC NC
ENABLE
NC
NC NC NC
R
REF
SDO
NC
LMH0302
SNLS247G –APRIL 2007–REVISED APRIL 2013 www.ti.com
Connection Diagram
The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Figure 1. 16-Pin WQFN
See Package Number RUM
PIN DESCRIPTIONS
Pin Name Description
1 SDI Serial data true input.
2 SDI Serial data complement input.
3 V
EE
Negative power supply (ground).
4 R
REF
Output driver level control. Connect a resistor to V
CC
to set output voltage swing.
5 NC No connect. Not bonded internally.
6 ENABLE Output driver enable. When low, the SDO/SDO output driver is powered off. ENABLE has an internal
pullup.
7 NC No connect. Not bonded internally.
8 NC No connect. Not bonded internally.
9 V
CC
Positive power supply (+3.3V).
10 SD/HD Output slew rate control. Output rise/fall time complies with SMPTE 424M / 292M when low and
SMPTE 259M when high.
11 SDO Serial data complement output.
12 SDO Serial data true output.
13 NC No connect. Not bonded internally.
14 NC No connect. Not bonded internally.
15 NC No connect. Not bonded internally.
16 NC No connect. Not bonded internally.
DAP V
EE
Connect exposed DAP to negative power supply (ground).
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