Datasheet
A1
B1
C1
V
+
OUTPUT
SD
C3
SL
INVERTING INPUT
A3
B3
NON-
INVERTING
INPUT
A2
V
+
C2
V
-
LMC8101
SNOS496F –AUGUST 2000–REVISED MARCH 2013
www.ti.com
Connection Diagrams
Figure 1. 8-Pin VSSOP Top View Figure 2. DSBGA Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
2KV
(3)
ESD Tolerance
200V
(4)
V
IN
differential ±Supply Voltage
Output Short Circuit Duration See
(5)(6)
Supply Voltage (V
+
− V
−
) 12V
Voltage at Input/Output pins V
+
+0.8V, V
−
−0.8V
Current at Input Pin ±10mA
Current at Output Pin
(5)(6)
±80mA
Current at Power Supply pins ±80mA
Storage Temperature Range −65°C to +150°C
Junction Temperature
(7)
+150°C
Infrared or Convection (20 sec.) 235°C
Soldering Information
Wave Soldering (10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Machine Model, 0Ω in series with 200pF.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature at 150°C. Output currents in excess of 40mA over long term may adversely affect
reliability.
(6) Short circuit test is a momentary test. Output short circuit duration is infinite for V
S
< 6V. Otherwise, extended period output short circuit
may damage the device.
(7) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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