Datasheet

LMC7215, LMC7225
SNOS882E –SEPTEMBER 1999–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
2 kV
Differential Input Voltage V
+
+0.3V, V
−
−0.3V
Voltage at Input/Output Pin V
+
+0.3V, V
−
−0.3V
Supply Voltage (V
+
–V
−
) 10V
Current at Input Pin ±5 mA
Current at Output Pin
(4)
±30 mA
Current at Power Supply Pin 40 mA
Lead Temperature (soldering, 10 sec) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
(5)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature isP
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
(1)
Supply Voltage 2V ≤ V
CC
≤ 8V
Temperature Range
(2)
−40°C to +85°C
Package Thermal Resistance (θ
JA
) 8-Pin SOIC 165°C/W
5-Pin SOT-23 325°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature isP
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
2.7V to 5V Electrical Characteristics
Unless otherwise specified, all limits specified for T
J
= 25°C, V
+
= 2.7V to 5V, V
−
= 0V, V
CM
= V
O
= V
+
/2. Boldface limits apply
at the temperature extremes.
Symbol Parameter Conditions LMC7215 LMC7225 Units
Typ
(1)
Limit
(2)
Limit
(2)
1 6 6 mV
V
OS
Input Offset Voltage
8 8 max
Input Offset Voltage
TCV
OS
2 μV/°C
Average Drift
I
B
Input Current 5 fA
I
OS
Input Offset Current 1 fA
Common Mode dB
CMRR See
(3)
80 60 60
Rejection Ratio min
(1) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(2) All limits are specified by testing or statistical analysis.
(3) CMRR measured at V
CM
= 0V to 2.5V and 2.5V to 5V when V
S
= 5V, V
CM
= 0.2V to 1.35V and 1.35V to 2.7V when V
S
= 2.7V. This
eliminates units that have large V
OS
at the V
CM
extremes and low or opposite V
OS
at V
CM
= V
S
/2.
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