Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- Absolute Maximum Ratings
- Operating Ratings
- DC Electrical Characteristics
- AC Electrical Characteristics
- DC Electrical Characteristics
- AC Electrical Characteristics
- Typical Performance Characteristics
- Application Information
- AMPLIFIER TOPOLOGY
- INPUT COMMON-MODE VOLTAGE RANGE
- RAIL-TO-RAIL OUTPUT
- CAPACITIVE LOAD TOLERANCE
- COMPENSATING FOR INPUT CAPACITANCE
- PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORK
- OFFSET VOLTAGE ADJUSTMENT
- UPGRADING APPLICATIONS
- DATA ACQUISITION SYSTEMS
- INSTRUMENTATION CIRCUITS
- SPICE MACROMODEL
- Typical Single-Supply Applications
- Revision History

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LMC6482AIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6482AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6482IMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMMX VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMC6482IMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMC6482IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 1