Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMC6035IMM VSSOP DGK 8 1000 210.0 185.0 35.0
LMC6035IMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMC6035IMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMC6035IMX SOIC D 8 2500 367.0 367.0 35.0
LMC6035IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMC6035IMXQ1 SOIC D 8 2500 367.0 367.0 35.0
LMC6035ITL/NOPB DSBGA YZR 8 250 210.0 185.0 35.0
LMC6035ITLX/NOPB DSBGA YZR 8 3000 210.0 185.0 35.0
LMC6036IMTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
LMC6036IMX SOIC D 14 2500 367.0 367.0 35.0
LMC6036IMX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2