Datasheet

LMC6022
SNOS622D –NOVEMBER 1994–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
Differential Input Voltage ±Supply Voltage
Supply Voltage (V
+
− V
−
) 16V
Lead Temperature (Soldering, 10 sec.) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
ESD Tolerance
(2)
1000V
Voltage at Output/Input Pin (V
+
) +0.3V, (V
−
) −0.3V
Current at Output Pin ±18 mA
Current at Power Supply Pin 35 mA
Power Dissipation See
(3)
Current at Input Pin ±5 mA
Output Short Circuit to V
−
See
(4)
Output Short Circuit to V
+
See
(5)
(1) Absolute Maximum Ratings indicate limits beyond which damage to component may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
(2) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(3) The maximum power dissipation is a function of T
J(max)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
− T
A
)/θ
JA
.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature and/or
multiple Op Amp shorts can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30
mA over long term may adversely affect reliability.
(5) Do not connect output to V
+
when V
+
is greater than 13V or reliability may be adversely affected.
OPERATING RATINGS
Temperature Range −40°C ≤ T
J
≤ +85°C
Supply Voltage Range 4.75V to 15.5V
Power Dissipation See
(1)
Thermal Resistance (θ
JA
)
(2)
8-Pin SOIC 165°C/W
(1) For operating at elevated temperatures the device must be derated based on the thermal resistance θ
JA
with P
D
= (T
J
−T
A
)/θ
JA
.
(2) All numbers apply for packages soldered directly into a PC board.
DC ELECTRICAL CHARACTERISTICS
The following specifications apply for V
+
= 5V, V
−
= 0V, V
CM
= 1.5V, V
O
= 2.5V, and R
L
= 1M unless otherwise noted.
Boldface limits apply at the temperature extremes; all other limits T
J
= 25°C.
LMC6022I
Symbol Parameter Conditions Typical
(1)
Units
Limit
(2)
V
OS
Input Offset Voltage 1 9 mV
11 max
ΔV
OS
/ΔT Input Offset Voltage
2.5 μV/°C
Average Drift
I
B
Input Bias Current 0.04 pA
200 max
I
OS
Input Offset Current 0.01 pA
100 max
R
IN
Input Resistance >1 TeraΩ
(1) Typical values represent the most likely parametric norm.
(2) All limits are guaranteed by testing or correlation.
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