Datasheet

LM97593
SNWS019B –JULY 2007–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
ADC Analog, Digital and IO Supply Voltages (V
A
, V
D
and V
DR
) −0.3V to 4.2V
Difference between V
A
, V
D
, and V
DR
≤ 100 mV
Positive Core Supply Voltage (V
D18
) −0.3V to 2.35V
Voltage on Any Input or Output Pin −0.3V to (V
DR
+0.3V)
(Not to exceed 4.2V)
Input Current at Any Pin other than Supply Pins
(4)
±5 mA
Package Input Current
(4)
±50 mA
Max Junction Temp (T
J
) +125°C
Thermal Resistance (θ
JA
) 39°C/W
Package Dissipation at T
A
= 25°C
(5)
3.2W
Human Body Model (1.5kΩ, 100pF) 2000 V
ESD Susceptibility
(6)
Machine Model (0Ω, 200pF) 200 V
Charge Device Model 750 V
Storage Temperature −65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, V
IN
< AGND, or V
IN
> V
A
), the current at that pin should be
limited to ±25 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power
supplies with an input current of ±25 mA to two.
(5) The maximum allowable power dissipation is dictated by T
J,max
, the junction-to-ambient thermal resistance, (θ
JA
), and the ambient
temperature, (T
A
), and can be calculated using the formula P
D,max
= (T
J,max
- T
A
)/θ
JA
. The values for maximum power dissipation listed
above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the
power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.
(6) Human Body Model is 100 pF discharged through a 1.5 kΩ resistor. Machine Model is 220 pF discharged through 0 Ω.
Operating Ratings
(1)(2)
Soldering process must comply with Texas Instrument's Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging
(3)
Operating Temperature Range −40°C ≤ T
A
≤ +85°C
ADC Analog, Digital and IO Supply Voltages (V
A
, V
D
and V
DR
) +3.0V to +3.6V
Digital Core Supply Voltage (VD18) +1.6V to +2.0V
Difference Between AGND, DGND, DRGND and D18GND ≤ 100 mV
Voltage on Any Input or Output Pin 0V to +3.3V
V
CM
1.0V to 2.0V
Clock Duty Cycle 30% to 70 %
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(2) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
(3) Reflow temperature profiles are different for lead-free and non-lead-free packages.
Reliability Information
Transistor Count 1.3 million
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