Datasheet

LM96163
SNAS433D –JUNE 2008–REVISED MAY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
Supply Voltage, V
DD
−0.3 V to 6.0 V
Voltage on SMBDAT, SMBCLK,ALERT, TCRIT, TACH, PWM Pins −0.5 V to 6.0 V
Voltage on Other Pins −0.3 V to (V
DD
+ 0. 3 V)
Input Current, D− Pin
(4)
±1 mA
Input Current at All Other Pins
(4)
5 mA
Package Input Current
(4)
30 mA
SMBDAT, ALERT, PWM pins
Output Sink Current 10 mA
Package Power Dissipation See
(5)
Junction Temperature 125°C
Storage Temperature −65°C to +150°C
Human Body Model 2500 V
ESD Susceptibility
(6)
Machine Model 250 V
Charged Device Model 1000 V
(1) All voltages are measured with respect to GND, unless otherwise noted.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee performance limits. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) When the input voltage (V
IN
) at any pin exceeds the power supplies (V
IN
< GND or V
IN
> V+), the current at that pin should be limited to
5 mA. Parasitic components and/or ESD protection circuitry are shown below for the LM96163's pins. Care should be taken not to
forward bias the parasitic diode, D2, present on pins D+ and D−. Doing so by more than 50 mV may corrupt temperature
measurements.
(5) Thermal resistance junction to ambient when attached to a 2 layer 4"x3" printed circuit board with copper thickness of 2oz. as described
in JEDEC specification EIA/JESD51-3 is 137°C/W. Thermal resistance junction to ambient when attached to a 4 layer 4"x3" printed
circuit board with copper thickness 2oz./1oz./1oz/2oz. and 4 thermal vias as described in JEDEC specification EIA/JESD51-7 is
40.3°C/W.
(6) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. Charged
Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated
assembler) then rapidly being discharged.
Operating Ratings
(1)(2)(3)(4)
Specified Temperature Range (T
MIN
≤ T
A
≤ T
MAX
) LM96163CISD –40°C ≤ T
A
≤ +85°C
Remote Diode Temperature Range -40°C ≤ T
D
≤ +140°C
Supply Voltage Range (V
DD
) +3.0 V to +3.6 V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee performance limits. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND, unless otherwise noted.
(3) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging
(4) Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.
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