Datasheet

LM96080
SNAS465D –SEPTEMBER 2009–REVISED MARCH 2013 www.ti.com
Absolute Maximum Ratings
(1)(2)(3)
Supply Voltage (V
+
) 6.0V
Voltage on SCL, SDA, RST_OUT/OS, GPI (CI), GPO, NTEST_IN/RESET_IN, INT_IN, FAN1 and
FAN2 (−0.3)V to +6.0V
Voltage on Other Pins (−0.3)V to (V
+
+ 0.3V) and ≤ 6.0V
(GND - GNDA) ±300 mV
Input Current at Any Pin
(4)
±5 mA
Package Input Current
(4)
±30 mA
Maximum Junction Temperature (T
J
max) 150°C
ESD Susceptibility
(5)
Human Body Model 3000V
Machine Model 300V
Charged Device Model 1000V
Storage Temperature (−65)°C to +150°C
For soldering specifications, see http://www.ti.com/lit/SNOA549
(6)
(1) All voltages are measured with respect to GND, unless otherwise specified
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage (V
IN
) at any pin exceeds the power supplies (V
IN
< (GND or GNDA) or V
IN
>V
+
), the current at that pin should be
limited to 5 mA. The 30 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 5 mA to six pins. Parasitic components and/or ESD protection circuitry are shown in the Pin Descriptions table.
(5) Human body model (HBM) is a charged 100 pF capacitor discharged into a 1.5 kΩ resistor. Machine model (MM), is a charged 200 pF
capacitor discharged directly into each pin. Charged Device Model (CDM) simulates a pin slowly acquiring charge (such as from a
device sliding down the feeder in an automated assembler) then rapidly being discharged.
(6) Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not..
Operating Ratings
(1)(2)
Supply Voltage (V
+
) +3.0V to +5.5V
Voltage on SCL, SDA, RST_OUT/OS, GPI (CI), GPO,
NTEST_IN/RESET_IN, INT_IN, FAN1 and FAN2 (−0.05)V to +5.5V
Voltage on Other Pins (−0.05)V to (V
+
+ 0.05)V and ≤ 5.5V
|GND − GNDA| ≤ 100 mV
V
IN
Voltage Range (−0.05)V to (V
+
+ 0.05)V
Temperature Range for Electrical Characteristics (−40)°C ≤ T
A
≤ +125°C
Operating Temperature Range (−40)°C ≤ T
A
≤ +125°C
Junction to Ambient Thermal Resistance (θ
JA
(3)
)
Package Number: PW 95°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND, unless otherwise specified
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
J
max, θ
JA
and the ambient temperature,
T
A
. The maximum allowable power dissipation at any temperature is P
D
= (T
J
max−T
A
)/θ
JA
.
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