Datasheet

LM95234
www.ti.com
SNIS136D AUGUST 2006REVISED MARCH 2013
Temperature-to-Digital Converter Electrical Characteristics
Unless otherwise noted, these specifications apply for V
DD
= +3.0Vdc to 3.6Vdc. Boldface limits apply for T
A
= T
J
= T
MIN
T
A
T
MAX
; all other limits T
A
= T
J
= +25°C, unless otherwise noted.
Parameter Conditions Typical
(1)
Limits
(2)
Units
(Limit)
Temperature Error Using Local Diode T
A
= -40°C to +125°C
(3)(4)
±1 ±2 °C (max)
Temperature Error Using Remote Diode
(5)
T
A
= +25°C to +85°C 65 nm Intel ±0.875 °C (max)
T
D
= +60°C to +100°C Processor
T
A
= +25°C to +85°C MMBT3904 ±1.1 °C (max)
T
D
= +60°C to +100°C Transistor
T
A
= +25°C to +85°C 65 nm Intel ±1.0 °C (max)
T
D
= 40°C to +125°C Processor
T
A
= +25°C to +85°C MMBT3904 ±1.3 °C (max)
T
D
= 40°C to +125°C Transistor
T
A
= 40°C to +85°C 65 nm Intel ±3.2 °C (max)
T
D
= 40°C to +125°C Processor
T
A
= 40°C to +85°C MMBT3904 ±3.0 °C (max)
T
D
= 40°C to +125°C Transistor
T
A
= 40°C to +85°C MMBT3904 ±3.3 °C (max)
T
D
= 125°C to +140°C Transistor
Local Diode Measurement Resolution 11 Bits
0.125 °C
Remote Diode Measurement Resolution Digital Filter Off 11 Bits
0.125 °C
Digital Filter On (Remote Diodes 1 and 2 13 Bits
only)
0.03125 °C
Conversion Time of All Temperatures at the All Channels are Enabled in Default State 1100 1210 ms (max)
Fastest Setting
(6)
1 External Channel TruTherm Active 34 37 ms (max)
1 External Channel TruTherm Inactive 31 34 ms (max)
Local only 30 33 ms (max)
Quiescent Current
(7)
SMBus Inactive, 1Hz Conversion Rate, 570 800 µA (max)
channels in default state
Shutdown 360 µA
D Source Voltage 0.4 V
Remote Diode Source Current High level 160 230 µA (max)
Low level 10
Power-On Reset Threshold Measured on V
DD
input, falling edge 2.8 V (max)
1.6 V (min)
TCRIT1 Pin Temperature Threshold Default Diodes 1 and 2 only +110 °C
TCRIT2 Pin Temperature Threshold Default all channels +85 °C
TCRIT3 Pin Temperature Threshold Default Diodes 3 and 4 only +85 °C
(1) Typicals are at T
A
= 25°C and represent most likely parametric norm.
(2) Limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level).
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the
internal power dissipation of the LM95234 and the thermal resistance.
(4) Thermal resistance junction-to-ambient when attached to a 4 layer printed circuit board per JEDEC standard JESD51-7:
(a) 14-lead WSON = 90°C/W (no thermal vias, no airflow)
(b) 14-lead WSON = 63°C/W (1 thermal via, no airflow)
(c) 14-lead WSON = 43°C/W (6 thermal vias, no airflow)
(d) 14-lead WSON = 31°C/W (6 thermal vias, 900 ln. ft. / min. airflow)
Note: all quoted values include +15% error factor from nominal value.
(5) The accuracy of the LM95234CISD is ensured when using a typical thermal diode of an Intel processor on a 65 nm process or an
MMBT3904 diode-connected transistor, as selected in the Remote Diode Model Select register. See typical performance curve for
performance with Intel processor on a 90 nm process. For further information on other thermal diodes see DIODE NON-IDEALITY or
www.ti.com.
(6) This specification is provided only to indicate how often temperature data is updated. The LM95234 can be read at any time without
regard to conversion state (and will yield last conversion result).
(7) Quiescent current will not increase substantially with an SMBus communication.
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