Datasheet
L0(GPI/O)
SI
SK
CS
SI/O
SC
V
DD
GND
0.1 PF
National
COP8SA
Microcontroller
LM95071/
LM95071-Q1
+3.3V
LM95071, LM95071-Q1
SNIS137D –AUGUST 2004–REVISED SEPTEMBER 2013
www.ti.com
Pin Description
Pin Symbol Name Description
Number
1 CS Chip Select input This pin receives an active-low signal from the controller to select the device.
2 GND Ground This is the power and signal ground return.
3 SI/O Serial Input/Output This serial, bidirectional, data bus pin transmits and receives signals to and from the
controller. Schmitt trigger input in the input mode.
4 SC Serial bus clock This serial clock signal comes from the controller. Schmitt trigger input.
5 V
DD
Positive Supply Voltage Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a 0.1 µF ceramic
capacitor to ground.
Typical Application
Figure 1. COP Microcontroller Interface
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Supply Voltage −0.3V to 6.0V
Voltage at any Pin −0.3V to V
DD
+ 0.3V
Input Current at any Pin
(2)
5 mA
Storage Temperature −65°C to +150°C
ESD Susceptibility
(3)
Human Body Model 2000V
Machine Model 200V
Soldering process must comply with Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging.
(4)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (V
I
) at any pin exceeds the power supplies (V
I
< GND or V
I
> V
DD
) the current at that pin should be limited to
5 mA.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.
(4) Reflow temperature profiles are different for lead-free and non-lead-free packages.
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