Datasheet

LM9036
SNVS140E –AUGUST 2003–REVISED MARCH 2013 www.ti.com
Figure 2. 8 Lead VSSOP Figure 3. 8 Lead SOIC
Top View Top View
LM9036MM-3.3, , LM9036MMX-3.3, LM9036MM-5.0, LM9036M-3.3, LM9036MX-3.3, LM9036M-5.0,
LM9036MMX-5.0 LM9036MX-5.0
See NS Package Number DGK See NS Package Number D
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Input Voltage (Survival) +55V, −45V
ESD Susceptibility
(3)
±1.9kV
Power Dissipation
(4)
Internally limited
Junction Temperature (T
Jmax
) 150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 100pF discharge through a 1.5kΩ resistor.
(4) The maximum power dissipation is a function of T
Jmax
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
Jmax
− T
A
)/θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM9036 will go
into thermal shutdown.
Operating Ratings
Operating Temperature Range −40°C to +125°C
Maximum Input Voltage (Operational) 40V
SOIC-8 (D) θ
JA
(1)
140°C/W
PFM (NDP0003B) θ
JA
(1)
125°C/W
PFM (NDP0003B) θ
JA
(2)
50°C/W
PFM (NDP0003B) θ
JC
(1)
11°C/W
MSO-8 (DGK) θ
JA
(1)
200°C/W
(1) Worst case (Free Air) per EIA / JESD51-3.
(2) Typical θ
JA
with 1 square inch of 2oz copper pad area directly under the ground tab.
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