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LM8850 Evaluation Board Layers

10 LM8850 Evaluation Board Layers

There are a few solder mask openings for various supercapacitor packages. If you plan on changing to a

different supercapacitor than what is initially assembled, be sure assemble using the best solder pad

openings for your supercapacitor footprint. Below, in the circled areas, are the initial pads used for the

TDK supercap initially assembled. If the given pads aren’t acceptable, the solder mask can be removed to

expose the copper for any footprint needed.

Figure 6. Top Layer

SNVA472A–March 2011–Revised May 2013 AN-2119 LM8850 Evaluation Board Application Note

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