Datasheet
Table Of Contents
- Features
- Applications
- Key Specifications
- Description
- Absolute Maximum Ratings
- Operating Ratings
- Temperature-to-Digital Converter Characteristics
- Logic Electrical Characteristics
- DIGITAL DC CHARACTERISTICS
- SMBus DIGITAL SWITCHING CHARACTERISTICS
- Functional Description
- LM86 REGISTERS
- COMMAND REGISTER
- LOCAL and REMOTE TEMPERATURE REGISTERS (LT, RTHB, RTLB)
- STATUS REGISTER (SR)
- CONFIGURATION REGISTER
- CONVERSION RATE REGISTER
- LOCAL and REMOTE HIGH SETPOINT REGISTERS (LHS, RHSHB, and RHSLB)
- LOCAL and REMOTE LOW SETPOINT REGISTERS (LLS, RLSHB, and RLSLB)
- REMOTE TEMPERATURE OFFSET REGISTERS (RTOHB and RTOLB)
- LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS)
- T_CRIT HYSTERESIS REGISTER (TH)
- FILTER and ALERT CONFIGURE REGISTER
- MANUFACTURERS ID REGISTER
- DIE REVISION CODE REGISTER
- APPLICATION HINTS
- Data Sheet Revision History
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM86CIM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM86
CIM
LM86CIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM 0 to 125 LM86
CIM
LM86CIMM NRND VSSOP DGK 8 1000 TBD Call TI Call TI 0 to 125 T10C
LM86CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 125 T10C
LM86CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM 0 to 125 T10C
LM86CIMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM86
CIM
LM86CIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM 0 to 125 LM86
CIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.