Datasheet

LM341/LM78MXX
www.ti.com SNVS090E –MAY 2004–REVISED AUGUST 2005
Table 1. θ
JA
Different Heatsink Area
Layout Copper Area Thermal Resistance
Top Sice (in
2
)
(1)
Bottom Side (in
2
) (θ
JA
, °C/W) TO-252
1 0.0123 0 103
2 0.066 0 87
3 0.3 0 60
4 0.53 0 54
5 0.76 0 52
6 1 0 47
7 0 0.2 84
8 0 0.4 70
9 0 0.6 63
10 0 0.8 57
11 0 1 57
12 0.066 0.066 89
13 0.175 0.175 72
14 0.284 0.284 61
15 0.392 0.392 55
16 0.5 0.5 53
(1) Tab of device attached to topside copper
Figure 16. θ
JA
vs. 2oz Copper Area for TO-252
Figure 17. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
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