Datasheet
LM75A
www.ti.com
SNOS808O –JANUARY 2000–REVISED MAY 2013
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage Pin (+V
S
) −0.3V to 6.5V
Voltage at A0, A1and A2 Pins −0.3V to (+V
S
+ 0.3V) and must be ≤ 6.5V
Voltage at OS, SCL and SDA Pins −0.3V to 6.5V
Input Current at any Pin
(2)
5 mA
Package Input Current
(2)
20 mA
Storage Temperature −65°C to +150°C
Human Body Model 2500V
ESD Susceptibility
(3)
LM75A Machine Model 250V
Charged Device Model 1000V
O.S. Output Sink Current 10 mA
O.S. Output Voltage 6.5V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
(2) When the input voltage (V
I
) at any pin exceeds the power supplies (V
I
< GND or V
I
> +V
S
) the current at that pin should be limited to
5mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 5mA to four.
(3) Human body model, 100pF discharged through a 1.5kΩ resistor. Machine model, 200pF discharged directly into each pin. The Charged
Device Model (CDM) is a specified circuit characterizing an ESD event that occurs when a device acquires charge through some
triboelectric (frictional) or electrostatic induction processes and then abruptly touches a grounded object or surface.
OPERATING RATINGS
Specified Temperature Range (T
MIN
to T
MAX
)
(1)
−55°C to +125°C
Supply Voltage Range (+V
S
) LM75A +2.7V to +5.5V
Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
(2)
(1) LM75A θ
JA
(thermal resistance, junction-to-ambient) when attached to a printed circuit board with 2oz. foil similar to the one shown in
Figure 2 is summarized in the table below the Operating Ratings table.
(2) Reflow temperature profiles are different for lead-free and non-lead-free packages.
TI Package Thermal
Device Number
Number Resistance (θ
JA
)
LM75AIM D0008A 200°C/W
LM75AIMM DGK0008A 250°C/W
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