Datasheet

LM7372
www.ti.com SNOS926E –MAY 1999–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)(3)
ESD Tolerance Human Body Model 1.5kV
(4)
Machine Model 200V
(4)
Suppy Voltage (V
+
−V
−
) 36V
Differential Input Voltage (V
S
= ±15V) ±10V
Output Short Circuit to Ground
(2)
Continuous
Storage Temp. Range −65°C to 150°C
Soldering Information Infrared or Convection Reflow (20 sec.) 235°C
Wave Soldering Lead Temperature (10 sec.) 260°C
Input Voltage V
−
to V
+
Maximum Junction Temperature
(5)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 200pF.
(5) The maximum power dissipation is a function of T
(JMAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
(JMAX)
– T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board. The value for θ
JA
is 106°C/W
for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, θ
JA
for the 16-Pin SOIC is
decreased to 70°C/W. 8-Pin SO PowerPAD package θ
JA
is with 2 in
2
heatsink (top and bottom layer each) and 1 oz. copper (see
Table 2).
Operating Ratings
(1)
Supply Voltage 9V ≤ V
S
≤ 36V
Junction Temperature Range (T
J
) LM7372 −40°C ≤ T
J
≤ 85°C
Thermal Resistance(θ
JA
) 16-Pin SOIC
(2)
106°C/W
70°C/W
8-Pin SO PowerPAD
(2)
(see Application Information) 47°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
(JMAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
(JMAX)
– T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board. The value for θ
JA
is 106°C/W
for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, θ
JA
for the 16-Pin SOIC is
decreased to 70°C/W. 8-Pin SO PowerPAD package θ
JA
is with 2 in
2
heatsink (top and bottom layer each) and 1 oz. copper (see
Table 2).
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