Datasheet

0.1
1 10 100 1000
I
SOURCE
(mA)
0.01
0.1
1
10
100
V
OUT
FROM RAIL (
V)
125°C
85°C
-40°C
25°C
V
S
= 30V
2 Ps/DIV
10 pF
V
S
= 10V, A
V
= +1, R
L
= 1 M:
2000 pF
10,000 pF
20,000 pF
5V/DIV
LM7332
SNOSAV4A –APRIL 2008–REVISED MARCH 2013 www.ti.com
Key Graphs
Output Swing
vs.
Sourcing Current Large Signal Step Response for Various Capacitive Loads
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Absolute Maximum Ratings
(1)(2)
Human Body Model 2 kV
ESD Tolerance
(3)
Machine Model 200V
V
IN
Differential ±10V
Output Short Circuit Duration See
(4)
,
(5)
Supply Voltage (V
S
= V
+
- V
−
) 35V
Voltage at Input/Output pins V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(6)
+150°C
Soldering Information: Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) Short circuit test is a momentary test. Output short circuit duration is infinite for V
S
≤ 6V at room temperature and below. For V
S
> 6V,
allowable short circuit duration is 1.5 ms.
(6) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
Supply Voltage (V
S
= V
+
- V
−
) 2.5V to 32V
Temperature Range
(1)
−40°C to +125°C
Package Thermal Resistance, θ
JA
,
(1)
8-Pin VSSOP 235°C/W
8-Pin SOIC 165°C/W
(1) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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