Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM7321MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM732
1MA
LM7321MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM732
1MA
LM7321MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AU4A
LM7321MFE/NOPB ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AU4A
LM7321MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AU4A
LM7321QMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AR8A
LM7321QMFE/NOPB ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AR8A
LM7321QMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AR8A
LM7322MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM732
2MA
LM7322MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM732
2MA
LM7322MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AZ4A
LM7322MME/NOPB ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AZ4A
LM7322MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AZ4A
LM7322QMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM732
2QMA
LM7322QMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LM732
2QMA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.